ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,999, issued on Aug. 4, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor power module" was invented by Katsushi Nakada (Toky... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,000, issued on Aug. 4, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor device and manufacturing method thereof" was inv... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,001, issued on Aug. 4, was assigned to Akash Systems Inc. (San Francisco). "Devices having and methods of forming thermally conductive subst... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,002, issued on Aug. 4, was assigned to LX SEMICON Co. LTD (Daejeon, South Korea). "Double-sided heat dissipation power semiconductor module ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,003, issued on Aug. 4, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore). "Heat radiation component and electronic apparatus" was inv... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,004, issued on Aug. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Thermal expansion matched chip module with int... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,005, issued on Aug. 4, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package with vapor chamber lid" was invented by ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,006, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for singulating semiconductor ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,007, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Multilevel package substrate for interlevel dielectric crack mitiga... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,008, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Jingu K... Read More